XL-BG01-04
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1. Sealed cabling holes to block-up the blas flow.
2. Improve the cooling efficiency of air conditioners.
3. Increase the amount of instruments in the data center.
4. Increase the pressure f plenum chamber under the floor, to ensure the cooling airflow can be sent further.
5. Increase the air volume from the air exhausting floor.
6. Reduce the humidity and control the cost.
7. The data center should be layoutted with hot channels, and it goes with it.
8. Reduce the cost for using more air conditioners.
1. Sealed cabling holes to block-up the blas flow.
2. Improve the cooling efficiency of air conditioners.
3. Increase the amount of instruments in the data center.
4. Increase the pressure f plenum chamber under the floor, to ensure the cooling airflow can be sent further.
5. Increase the air volume from the air exhausting floor.
6. Reduce the humidity and control the cost.
7. The data center should be layoutted with hot channels, and it goes with it.
8. Reduce the cost for using more air conditioners.
1. Sealed cabling holes to block-up the blas flow.
2. Improve the cooling efficiency of air conditioners.
3. Increase the amount of instruments in the data center.
4. Increase the pressure f plenum chamber under the floor, to ensure the cooling airflow can be sent further.
5. Increase the air volume from the air exhausting floor.
6. Reduce the humidity and control the cost.
7. The data center should be layoutted with hot channels, and it goes with it.
8. Reduce the cost for using more air conditioners.
1. Sealed cabling holes to block-up the blas flow.
2. Improve the cooling efficiency of air conditioners.
3. Increase the amount of instruments in the data center.
4. Increase the pressure f plenum chamber under the floor, to ensure the cooling airflow can be sent further.
5. Increase the air volume from the air exhausting floor.
6. Reduce the humidity and control the cost.
7. The data center should be layoutted with hot channels, and it goes with it.
8. Reduce the cost for using more air conditioners.
Airflow management device designed to seal cable openings in new raised-floor systems prior to the installation of communication or power cabling.
AT-BG01
Material : Plastic
Size: 223x144x28mm
AT-BG02
Material: All Aluminium with brush
Size: 276mm*80mm*28mm
AT-BG03
Material: All Aluminium with brush
Size: 158mm*80mm*28mm
AT-BG04
Material: All Aluminium with brush
Size: 80mm*80mm*28mm
Airflow management device designed to seal cable openings in new raised-floor systems prior to the installation of communication or power cabling.
AT-BG01
Material : Plastic
Size: 223x144x28mm
AT-BG02
Material: All Aluminium with brush
Size: 276mm*80mm*28mm
AT-BG03
Material: All Aluminium with brush
Size: 158mm*80mm*28mm
AT-BG04
Material: All Aluminium with brush
Size: 80mm*80mm*28mm
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